Cranston, RI - AIM Solder, a leading global manufacturer of assembly materials for the electronics industry, will highlight their new NC259 Solder Paste and NC277 Liquid Flux at the 2013 SMTA International Expo, October 15th – 16th at the Fort Worth Convention Center in Fort Worth, Texas. NC259 is a low-cost, lead-free and halogen-free solder paste that offers the performance of tin/lead and high-silver, lead-free solder pastes minimizing post-process residue and graping. NC259 is formulated to provide one of the longest pause-to-print windows in the industry, resulting in less solder waste, fewer restart costs and improved overall quality of prints. NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux that is suitable for long thermal demands. This flux can withstand the high thermal preheats and provides a broad activation range, proving to be an excellent flux for a variety of process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys. In addition, NC277 offers medium post-process residues and has shown to reduce preventative maintenance requirements for spray fluxing applications. To discover all of AIM’s products and services, including lead-free and halogen-free solder products and SN100C, visit the company at booth no. 307 at SMTAI this October.
For more information, please visit AIMsolder.com.