Thermally Conductive Epoxy

Aremco-Bond 860 is a two-component, 100% solids, aluminum nitride filled, thermally conductive epoxy, that is ideal for bonding and small encapsulation applications to 400 ºF . . .

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Valley Cottage, NY – Aremco-Bond 860, a new high temperature, aluminum nitride filled, thermally conductive, electrically insulating epoxy system developed by Aremco Products, Inc., is now used for electrical and electronic bonding applications to 400 oF (204 oC). Aremco-Bond 860 is a two-component, 100% solids, aluminum nitride filled, thermally conductive
epoxy, that is ideal for bonding and small encapsulation applications to 400 ºF (204 ºC). Aremco-Bond 860 exhibits excellent adhesion to a variety of high temperature plastics such as polyimides and composites, as well as ceramics, glass, and high expansion metals. Aremco-Bond tm 860 is mixed in a ratio of 1 part base resin to 1 part activator by weight and cures in 24 hours at room temperature or in 2 hours at 200 oF. After curing, it exhibits a thermal conductivity of 8.5 Btu-in/hr-ft2-oF and dielectric strength of 250 volts/mil. The tensile shear strength is 1,375 psi. This system also demonstrates very good corrosion protection and thermal shock resistance. Typical applications for Aremco-Bond 860 include the bonding of heat sinks and fins used in heat exchangers and electrical/electronic assemblies. Aremco-Bondtm 860 is supplied in pre-measured pint, quart, gallon and five gallon kits from stock.

For more information, please visit www.aremco.com.

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