Electrically conductive adhesive

By Staff -- Industrial Distribution, 12/1/1998

Electrically conductive adhesive developed for the microelectronics, telecommunications packaging and assembly market where low-temperature curing and flexibility are required; high performance epoxy was specially designed for applications related to flex circuits, smart cards and bonding heat sensitive components/substrates; develops resilient, electrical and thermally conductive bonds between dissimilar materials such as metals, ceramics, PVC, Melinex and various other plastics. Tra-Con, Inc.

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